grindingarena

What Is Wafer Grinding?

Grinding is a mechanical process that removes material from the surface of a wafer. It is sometimes called thinning. Backgrinding refers to grinding the backside of a wafer, typically after structures have been built on the front.

The Photo to the left depicts SQI’s Grinding arena, showing the VG502 (right) and  the GNX-200.

Process Details

The chuck rotates the wafer about its center while the wheel removes material. Removed material is flushed out of the tool with de-ionized water.

Thickness is controlled by the recipe, which feeds the grinding wheel down to a specified Z position.

The non-ground side may be protected with UV or non-UV tape, as well as photoresist.

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Applications

The non-ground side may be protected with UV or non-UV tape, as well as photoresist.

Very flat or very thin wafers

Removal of defects

Double-side grind

Combined with polishing service

Thinning of wafers with devices or structures already in place