Temporary Wafer Bonding

SQI is currently providing temporary Wafer bonding services using 2 methods.

1) Thermal Cross Link (Bonding at Higher Temperatures)

2) Polyimide family Adhesive (Bonding at lower temperatures)

Bonds are temporary and allow grinding and polishing of wafers to very thin levels

 

Please contact Silicon Quest International for more information

Applications:

  • High Power Circuits
  • High Temperatures
  • High Switching -RF
  • MOSFET/IGBT/TRIAC – High Power Levels

Key Features:

  • High Strength Temporary Bond
  • Wafers can under go Grind & Polish to very thin levels
  • Allows handling of thin wafers
  • No Stacking Faults
  • Excellent Thermal Conductivity of final thin wafer

*Two bonding methods

Bonding

*Wafer temporary bond

 

bonding1

 

 

 

 

Check Inventory

Inventory

Ready to Order?

For more information
or to order
call 
SQI SALES
800-959-3556 Toll Free