Thinning & Grinding

SQI precision wafer thinning & grinding uses precise grinding and polishing techniques to achieve very high tolerances required by industry. SQI has the following capabilities:

      • Precision: TTV <1um Wafer-to-wafer thickness <1um
      • Thin Wafers: Ground thickness below 50um
      • Back grinding: Grinding of circuited wafers ESD protection
      • Wafer bonding: Bonding to a handle wafer for precise grinding and polishing
      • SOI Processing: Thinning of bonded SOI stacks Polishing for bonding preparation
      • Single-side: Single-sided grinding and polishing
      • Double-side: Double-side grind Simultaneous double-side polishing Protection of front or back surface as needed.
      • Size: Any Size & Shape
      • Material: Any Material – CZ, FZ, SiC, Quartz, Sapphire

Please contact Silicon Quest International for more information

*Precision Wafer Thinning & Grinding


*Precision Grind








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